xcede ram connectors. These connectors are available in 3-, 4- and 6-Pair configurations. xcede ram connectors

 
 These connectors are available in 3-, 4- and 6-Pair configurationsxcede ram connectors  Integrated guidance, keying and polarizing side walls available

高速、高密度背板系统包括了各种对数和列数的ExaMAX®和XCede® HD。. 1. The XCede daughtercard connector can be assembled using individual segments up to 8” in length (8 inches for 2, 3, and 4 pair connectors and 6 inches for 5 and 6 pair connectors), and segments may be joined after individual pressing to total over 18” in length. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. Amphenol Communications Solutions XCede high-performance backplane connector system. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. XCede® HD是一个采用. Dislaime Please note that the above information is subject to change without notice. xcede hd backplane assembly 4 pair connector, leadfree part no. 4、6或8列. Vertical or Right Angle. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Out of these, the cookies that are categorized as necessary are stored on your browserGermany. XCede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. 1. XCede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. 1. The XCede HD interconnect platform also has available RAM (Right Angle Male). Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed, serial data rate requirements demanded by next-generation equipment in data centers and service. Brand of Product:Amphenol ICC,Part#:947-4XXX-XXX,Product Category:XCede RAM SIGNAL WAFER,Data. XCede® Backplane Connector MATERIAL §§Housing: Liquid Crystal Polymer §§Contact Base Metal: Copper Alloy §§Plating: Performance-based plating at separable interface; meets requirements of product specification ELECTRICAL PERFORMANCE §§Signal Current Rating: 1A per contact §§Ground Current Rating: 2A per contactAmphenol's Flat Flexible Cable (FFC) Jumpers are available in a wide range of standard cable lengths to meet the wide range of flexible interconnect requirements between two PC boards. High Speed Cables & Connectors; HDTF - Samtec XCede® HD 1. View Substitutes & Alternatives along with datasheets, stock, pricing and search for other Backplane Connectors products. Up to 3. XCede® connectors also address. 3. 1 DOCUMENTS 2. 2-, 3-, 4-, 5-, 6-Pair configurations. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 4 differential pairs/inch. Amphenol Xcede Series High Speed / Modular Connectors are available at Mouser Electronics. DC configurations may also be determined by the XHD2 RAM connector to which they will mate for co -planar applications. Offering a linear density of up to 84 differential pairs per inch and can meet requirements of high density architectures. High Speed Cables & Connectors; HDTF - Samtec XCede® HD 1. 63. Integrated Circuits IGBTs MOSFETs Discrete Semiconductors RF and Microwave Passives Motors & Actuators. Vertical backplane header configurations provide two, four or six differential signal pairs per column wafer with four, six or eight wafers per signal connector module. TB-2253 XCede HD Family Daughtercard Wafer Removal and Replacement. 信号端子上可实现高达3. XCede® connectors also address requirements for high linear signal density at the backplane. 2 TB-2244 XCede HD Family Daughtercard Connector Press-Fit Installation Process 3. XCede Connectors are available at Mouser Electronics. Description Initial Date “-“ S1188 Initial Release T. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. refer to tb-2235 for xcede hd product specifications. Each port offers 4 channels to increase port density which contributes to more board real estate and immense cost savings. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Please confirm your currency selection:2. 2 The XCede product family encompasses XCede, XCede Plus, and X2 product lines, and their corresponding product derivatives including; daughtercard, backplane, mezzanine, right-angle-male (RAM), orthogonal, right-angle-male Figure 20: Example XCede® HD Midplane Connector 20 LIST OF TABLES Table 1: XCede® HD , XCede® HD Plus and XCede® HD2 15. Features. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. SIMM was one of the earliest multichip memory modules used in PCs, generally with 30pins and 70pins, and a 32–bit data path. Column counts of 4, 6 and 8 allow for sizing the connector to the required differential pair count. 1 Fillets An extension of the pad at the interface of the trace to the pad that will allow more pad area in the event that the pad to hole registration compromises the interconnect area. This document is intended to serve as an application guide for designing the XCede HD connector system into various customer system configurations. 5 application, evolved up to the further PCIe Gen. XCede® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. A HIGH-DENSITY, DIFFERENTIAL, LOW-COST CONNECTOR SOLUTION FOR DATA. The XCede product family encompasses XCede®, XCede Plus®, and X2 product lines, and their corresponding product derivatives including; Daughtercard, backplane, mezzanine, right-angle-male (RAM), orthogonal, right-angle-male direct-attach orthogonal (RAM DA ortho), and cable backplane interconnect systems. 3. Connectors with six differential pairs per column fit 36 mm minimum card slot pitch and provide 82. TARGET MARKETS. DC Connector Configurations. Click to download Certificate of. Amphenol TCS XCede® Backplane Connectors are designed to offer readily available 85Ω and 100Ω solutions while maintaining the same mating interfaces. Role: Data Engineer Salary: up to €95k (DOE) + Benefits Remote Working Policy: Fully remote available Location: Mainz (fully remote) Tech Stack: Spark/Hadoop, Data Lake, AWS/Azure, Python, Kafka, Airflow, Docker, CI/CD. Dislaime Please note that the above information is subect to change without notice. 0 DEFINITIONS 4. Change LocationAmphenol TCS XCede® Backplane Connectors are designed to offer readily available 85Ω and 100Ω solutions while maintaining the same mating interfaces. Login or REGISTER Hello, {0}. Login or REGISTER Hello, {0}. Login or REGISTER Hello, {0}. Xcede Group is a global recruitment organisation that delivers technology and energy talent solutions which enable companies to innovate and grow. 4, 6 or 8 columns. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. 3-, 4- and 6-pair designs. Find Parts Learn More. Manufacturer of Connector and Connector Systems. 3. XCede® connectors also address. XCede PRODUCT FAMILY DAUGHTERCARD MODULE REMOVAL AND REPLACEMENT . 99 $ 19. XCede® Connectors - Amphenol CS | DigiKeyAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Upload your CV. Let’s take a look at a typical higher level motherboard for an example of connector and port types. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 4, 6 or 8 columns. Memory card connector / PCI. F X Connectors in Victoria, reviews by real people. Signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82 differential pairs/inch. XCede® connectors also address requirements for high linear signal density at the backplane and daughter card interface. The series offers mechanical. BENEFITS. 2” Long 694-4529-000 – 2-Pair RAM Loading Head 2. Across our key areas, our experts operate with a. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. The XCede product family encompasses XCede®, XCede Plus®, and X2 product lines, and their corresponding product derivatives including; Daughtercard, backplane, mezzanine, right- angle-male (RAM), orthogonal, right-angle-male direct-attach orthogonal (RAM DA ortho), and cable backplane 1. 80 mm高密度背板垂直插头. Wide shield contacts feature a stiffness enhancing rib and are advanced well ahead of the signals for “drag your finger across” robustness. § Differential pairs 28-84 per inch (11-33 differential pairs perBuy 923400J40H - Amphenol Communications Solutions - Connector, 4 Col x 4 Diff Pair, XCede HD Series, 1. Amphenol TCS XCede Backplane Connectors feature up to 82 differential pairs as well as 2-, 3-, 4-, 5-, and 6-pair configurations. XCede® BACKPLANE CONNECTOR SYSTEM - FCI. XCede® HD结合了小巧的外形和优异的设计灵活性,实现了电路板和系统空间的大幅节省。系统的模块化使设计师能够借助可选电源模块、导引和锁合以及侧壁来打造出完全定制的背板解决方案,从而提高耐用性。 XCede Plus leverages the same core technologies as XCede with improved signal integrity performance while maintaining backwards mating interface compatibility with existing XCede products. 2. Receptacle connectors and pin connectors are through hole devices with eye-of-the-needle compliant pin contacts. Complementary guide and power modules are also included in the product range. Find Parts. It is intended to provide general guidance for development of customer designs It is intended to provide general guidance for development of customer designs and application processes as they relate to this product family. 9 signal pairs per inch are. Login or REGISTER Hello, {0}. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with coolingComponents. 2. XCede HD & XCede HD PLUS press fit backplane connector family onto a printed circuit board (PCB). 4 differential signal pairs/inch. Mouser offers inventory, pricing, & datasheets for Amphenol XCede HD Series High Speed / Modular Connectors. Integrated power and guidance. 1. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. The Molex EXTreme LPHPower Connector is a mixed, high current power and signal connector system that picks up where traditional connectors leave off. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Vertical or Right Angle. ExaMAX® 2. performance (up to 28+ Gb/s) in a Hard Metric form factor. Your session is about to timeout due to inactivity. You previously purchased this product. Amphenol is one of the leading manufacturers of Backplane connectors. Check Pricing. Login or REGISTER Hello, {0}. EN. 4 FMC+ VITA 74 VNX适用于密度关键型应用的小型高密度背板系统,采用模块化设计并提供可选功能,以提升灵活性和实现可定制解决方案。XCede® BACKPLANE CONNECTOR SYSTEM - FCI. EN. 7. An organizer can be used to combine groups of right-angle signal, guide and power modules establishing an integrated daughter card. 2. 12 - 48 pairs. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 1. Buy 923400E40H - Amphenol Communications Solutions - Connector, 8 Col x 4 Diff Pair, XCede HD Series, 1. Login or REGISTER Hello, {0}. EspañolDownload XCede® Right Angle Receptacle 4-pair 8 column. Scalable upgrades to 56Gb/s. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 2. - FCI. XCede ® HD and XCede ® HD Plus, this connector provides . 2. 2" long and has an x4 connector. 2. 1. Customer Measurement Report: FCI XCede® Connector. c-jx410-51594 a creo files jx410-51594_bp . C&K Components. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Mechanical longevity and ruggedness. DETAILS. We believe that unlocking the potential of our workforce through outstanding training, earnings potential and reward structures is key to Xcede’s success. . View eCAD Files. 54, 3. HDTM. 3A per pin current rating and mount individually to the backplane. 1. 1. 8 mm column pitch representing a 35% increase versus XCede®. Samtec XCede® HD HPTS 3. refer to c-922-4x0a-500 for signal connector detail. com. High-density backplane system – up to 84 differential pairs per linear inch. Available with 40, 60 and 80 signal pins. Buy 928-4050-A7H - Amphenol Communications Solutions - Connector, 4 Diff Pair, XCede HD Plus Series, Receptacle, Press Fit. XCede® connectors also address. XCede ® HD and XCede ® HD Plus, this connector provides . Features. 4, 6 or 8 columns. Available in industry-standard 2. FCI released XCede vertical backplane headers and right-angle daughter card receptacles designed for 25 Gb/s performance. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 2 Reference Documents TB-2235 XCede HD General Product Specifications TB-2237 XCede HD Routing Guidelines TB-2252 XCede HD Backplane Connector Installation 2. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 三个等级的上电次序实现了热插拔. 80mm Right-Angle Backplane Receptacle (HDTF) From: £2. These modules consist of a 12. This card can be used in an ITX system with an M. 3-, 4- and 6-pair designs; 4, 6 or 8 columns; Standard or high-speed wafers available; 85 Ω and 100 Ω options; Modular design. XCede® connectors also address. They can either add a new cabling solution with backplane components at right angles, or expand their systems horizontally. XCede ® HD Plus. Offering a linear density of up to 84 differential pairs per inch and can. signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. 4 differential signal pairs per inch are provided corresponding to a minimum slot spacing of 36 mm. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD connector meets requirements of high density architectures with 35% increase in density as compared to standard XCede®. Login or REGISTER Hello, {0}. XCede® connectors also address. screw length and part number are dependent on daughtercard thickness (as specified from configurator). Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions. The XCede HD® connector leverages the same core technologies as standard XCede®, providing a robust solution for tighter card pitches and chassis designs where space requirements and density are critical. See Appendix “A” for the seating press recommendations and process recommendations. See Figure 15 for details. Article: 00028492. The PCIe bus, NC-SI bus, SMBus interface, various other sideband signals, and power are assigned to this connector. 3. by Xcede. This was soon replaced by DIMM with a 64-bit data path. XCede® connectors also address. These modules consist of a 12. XCede® HD combines a small form factor with incredible design flexibility for significant board and system space savings. QSFP+ 40G transceiver with MTP/MPO connector; MTP/MPO 12 Fiber Trunk Cable. 6. Features. Luxshare-TECH Gen-Z provides the full range of configuration: 1C,2C,4C,4C+,8C and HP (. • FCI Product Specfication GS-12-588 (XCede® Connector System) • FCI Repair Manuals (TBD) 4. Español $ USD United States. Random Access Memory, or RAM (pronounced as ramm ), is the physical hardware inside a computer that temporarily stores data, serving as the computer's "working" memory. see tb-xxxx for board weight limitations. 65; 29 In Stock; New Product; Mfr. XCede® Family Cable Assemblies MATERIAL §§Contacts: High performance Copper Alloy §§Plating(s): Performance-based plating at separable interface (Telcordia GR-1217-CORE) §§Housings: High Performance Thermoplastic, UL94-V0. The XCede HD2 connector family consists of modular configurations with custom power and guidance. XCede® connectors also address. XCEDE® BACKPLANE CONNECTOR SYSTEM XCEDE® POWER SYSTEM 150 grams normal force nominal POWER RATING Modular construction gives an effective current density of 8. Accessories; Audio Products; CapacitorsAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. One-Piece Interface PCB Array Connectors Memory Card Connectors Custom Products VITA 42 XMC VITA 57. XCede ® HD is a small form factor system with a modular design for significant space savings and. XCede® Stacker. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. XCede HD achieves the highest performance in an HM compatible form factor. Login or REGISTER Hello, {0}. TB-2023 Amphenol TCS Commercial Connector Qualification Plan TB-2237 XCede HD Routing Guidelines 2. This website uses cookies to improve your experience while you navigate through the website. Features. XCede® Family Cable Assemblies MATERIAL §§Contacts: High. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Contact us today for more details of XCede HD, part number 968-4200-A1H. Mouser offers inventory, pricing, & datasheets for Amphenol Xcede Series High Speed/Modular Connectors. Login or REGISTER Hello, {0}. Nov 13, 2019. RF Connectors Valcon IPEX Type RF Samtec Bulls Eye® RF Samtec Ganged RF. Skip to Main Content (800) 346-6873. Power blades rated up to 60 A per power bank. These connectors are ideal for meeting a wide variety of application needs, including Ethernet and PCI. Samtec XCede® HD 3. 0 DEFINITIONS 4. 1. Nashua, NH, February 2, 2009– Amphenol TCS, the leading provider of high performance backplane interconnect systems, today announced two additions to the XCede® connector platform – XCede 85 Ohm and XCede cables and assemblies. 3. Attention! Your ePaper is waiting for publication! By publishing your document, the content will be optimally indexed by Google via AI and sorted into the right category for over 500 million ePaper readers on YUMPU. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 4, 6 or 8 columns. XCede® connectors also address. Price request; Print; Specifications. High Speed / Modular Connectors XCede HD High-Density Backplane Custom Right-Angle Module BSP-226769-01; Samtec; 1: $29. 4. Ruggedized design for high reliability and ease of application. Modular design provides flexibility in applications. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 80 mm column pitch. the use of advanced engineering polymers in a unique 3-D resonance. DETAILS. 20mm Power Modules. The diagram below, created by NTT DATA based on the IDS-RAM Information Model *3, shows the basis of data model. XCede® connectors also address. 54, 3. 2. 1. Description Initial Date “A” S2401 Initial Release E. The stiffener may help straighten the board edge, but this does not necessarily preclude the need for additional board stiffening. Free shipping on many items | Browse your favorite brands | affordable prices. High-speed, high-density backplane systems include ExaMAX ® and XCede ® HD in a variety of pair and column counts. 1. The stiffener may help straighten the board edge, but this does not necessarily preclude the need for additional board stiffening. Download M12 PCB MOUNT CONNECTOR, X-CODED, FEMALE. signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. VVG-Befestigungstechnik GmbH & Co. See Figure 15 for details. Please confirm your currency selection:Buy XCede HD Series Backplane Connectors. Three levels of sequencing enable hot plugging. This type of cable is suitable for high-density networks and can reach a much longer distance than DAC and AOC. For a 6-pair differential connector per column, 82. Contact Mouser (USA) (800) 346-6873 | Feedback. was founded in 1987 with the mission of becoming a specialty connector manufacturer, delivering highest quality products and providing unparalleled customer service. Daugtercard connectors feature Amphenol’s integral stiffener which allows designersDataspace Connector's data model is designed based on IDS-RAM. Dislaime Please note that the above information is subect to change without notice. Buy 10113949-L0E-20DLF - Amphenol Communications Solutions - Connector, FCI XCede Series, 32 Contacts, Header, Press Fit, 8 Rows. 2. 10119128-B0C-40DLF Datasheets | Backplane Connectors - Specialized Connector Header, Male Pins and Blades Through Hole Black XCede®, Guide Left By apogeeweb, 10119128-b0c-40dlf, 10119128-b0c-40dlf datasheet,10119128. Separate the interface from 40G to four 10G. 6. Rugged Edge Rate® contact system. The system’s modularity gives designers the opportunity to create a fully custom backplane solution with optional power modules, guidance. Figure 20: Example XCede® HD Midplane Connector 20 LIST OF TABLES Table 1: XCede® HD , XCede® HD Plus and XCede® HD2 15. Buy 928-4000-A7H - Amphenol Communications Solutions - Connector, 4 Diff Pair, XCede HD Series, Receptacle, Press Fit. Xcede's first Data Networking Event in Manchester was a great success, and we can't thank the incredible team at Moneysupermarket enough for co-hosting with us at their fantastic Manchester office! 🤝🏙️ Excellent insights were shared by our distinguished speakers: 🌟 🎙️ Jon Howard from the BBC 🎙️ Chris Soulier from Cinch 🎙️ Gemma Turner from The Very. XCede HD, XCede HD PLUS & XCede HD2 press fit backplane connector family onto a printed circuit board (PCB). XCede® HD combines a small form factor with incredible design flexibility for significant board and system space savings. XCede ® High-Performance Backplane Connector System. XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. XCede® HD 1. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 12 - 48 pairs. 1. A HIGH-DENSITY, DIFFERENTIAL, LOW-COST CONNECTOR SOLUTION FOR DATA RATES UP TO 14 GBPS. 1. 0A: 250V: EXTreme OrthoPowerНа страницах каталога оборудования вы найдете Connectors: board-to-board различных производителей - большой выбор оборудования и техники. Copper Weight and Annular Ring (“A/R”) 7 Table 2: XCede® HD and XCede® HD Plus 17. Integrated power and guidance. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 3-, 4- and 6-pair designs. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD Plus connector meets the high-density needs of today's challenging architectures. XCede® connectors also address. Up to 82 differential pairs per linear inch. XCede® Family Cable Assemblies § Extends the reach of passive copper for next generation real world system designs; complementary with direct orthogonal designs, intermatable with existing board mount connector designs § Lowers overall system costs by reducing or eliminating the need for expensive active devices like retimers and high XCede HD2 backplane interconnect system. HIGH SPEED HARDMETRIC CONNECTOR FOR BACKPLANE WITH VIRTUAL SHIELD TECHNOLOGY AirMax VS ®. Designed to meet UL 1977 CAF (Conductive Anodic Filament) spacing Housing: High-temperature thermoplastic, UL94-V0 Wafers: High-temperature thermoplastic, UL94-V0 Contacts: High-performance copper alloy Platings. DETAILS. ExaMAX®可实现高达56 Gbps的性能,并使设计师能够选择优化密度或最大程度地减少电路板层数。. Buy XCede HD Plus Series Backplane Connectors. REFER TO TB-2150 FOR XCede PRODUCT SPECIFICATIONS. Inactivity Warning Dialog. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Same mechanical benefits as backplane connectors; High pin counts, blind mate & high density; Low loss twin ax cable; Overcomes limitation of PCB materials; Linear transmission to ~30 GHz; Enables 25G NRZ and 56G PAM4; Flexible pin out; Allows for full mesh designs with cable harnesses; 30 - 26 AWG wire gauges; Optimization of transmission and. Features. The XCede® Right-Angle Male (XCede® RAM) connector is an intelligent device that offers two options for designers. DC Connector Configurations. Attention! Your ePaper is waiting for publication! By publishing your document, the content will be optimally indexed by Google via AI and sorted into the right category for over 500 million ePaper readers on YUMPU. Pitch (mm): Circuits: Current (MAX per contact): Voltage: 1. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 1. XCede® connectors also address. 7. • FCI Product Specfication GS-12-588 (XCede® Connector System) • FCI Repair Manuals (TBD) 4. Your Price. 20mm HPTS Power Modules feature press-fit tails, vertical mounts, and come in a variety of body heights to match signal module pair count. Login or REGISTER Hello, {0}. Xcede Group is a global recruitment organisation that delivers technology and energy talent solutions which enable companies to innovate and grow. Login or REGISTER Hello, {0}. See section 4 regarding XHD2 RAM connectors. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Skip to Main Content (800) 346-6873. 80 mm高密度背板垂直插头. Login or REGISTER Hello, {0}. XCede High Speed / Modular Connectors are available at Mouser Electronics. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. After the reboot, the 40G port light turns yellow, which means the 40G-10G split configuration is successful. 2. Pitch (mm): Mated Height (mm): Circuits: Current (MAX): 2. If you need to add wires, there is an additional cost: please contact us and we will help you get the order processed. XCede 85 Ohm for applications where matching lower system impedance is desired and XCede cable. The XCede ® HD Plus backplane connector achieves high performance (up to 28+ Gb/s) in a Hard Metric form factor. The XCede HD® connector leverages the same core technologies as standard XCede®, providing a robust solution for tighter card pitches and chassis designs where space requirements and density are critical. High-speed, high-density backplane systems include ExaMAX® and XCede® HD in a variety of pair and column counts. 11. Newark offers fast quotes, same day shipping, fast delivery, wide inventory, datasheets & technical support. Contact us today for more details of XCede HD, part number 968-4200-A1H. use keep out zone. Login or REGISTER Hello, {0}. Xcede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. 08mm pitch sizes, this single-row, wire-to-board and board-to-board product family is cost effective and versatile. developers with a readily available robust solution for tighter card pitches and chassis designs where space requirements and density are critical.